Lead-Free Solder Preforms

What is Lead-Free Solder Preform?
Lead-free solder preforms are precision-shaped solder pieces made from environmentally friendly alloys such as SnAgCu, designed to meet RoHS compliance. They offer excellent wettability, mechanical strength, and thermal stability, making them ideal for semiconductor, optoelectronic, and consumer electronics applications.

Alloy Options

Customizable Shapes & Sizes

Available in standard and custom shapes like discs, rectangles, rings, and ovals.

Designed to fit various packaging and automated assembly needs.

Applications

Lead-free solder preforms are widely used in electronics assembly that requires RoHS compliance and high reliability. 

Typical applications include: Semiconductor packaging, optoelectronic modules, consumer electronics, automotive systems, communication devices, and lead-free soldering of miniature electronic components.

Automatic Feeding Solutions 

Automated and precise delivery of solder preforms to improve efficiency, consistency, and throughput in high-volume production.

(a) Tape and Reel Package (b) Waffle Tray Package (c) Plastic Tape Package (d) Blue Film Package

Quality Control Highlights

• High-Purity Raw Materials
  Solder alloys are made with high-purity gold and alloy elements for reliability.

• Full Material Traceability
  All batches are tracked to ensure consistent quality and avoid contamination.

• Alloy & Melting Point Testing
  Each batch is tested for composition and melting point accuracy.

• Performance Verification
  Key properties like wettability, conductivity, and hermeticity are evaluated.

• Clean Processing & Visual Check
  Produced in cleanroom conditions with inspection of surface and dimensions.

• Standard Sampling Procedure
  Inspections follow GB/T2828 S-3 for balanced quality control.