Lead-Based Solder Preforms

What is Lead-Based Solder Preform?

Lead-based solder preforms are solder pieces made from lead-containing alloys, known for their stable eutectic melting point and excellent wettability. They are widely used in applications requiring high reliability, strong conductivity, and well-established soldering processes.

Alloy Options 

Customizable Shapes & Sizes

Available in standard and custom shapes like discs, rectangles, rings, and ovals.

Designed to fit various packaging and automated assembly needs.

Applications

Lead-based solder preforms are widely used in industries requiring high reliability and consistent soldering performance.
Typical applications include: Aerospace electronics, military-grade packaging, optoelectronic sensor modules, power semiconductor devices, RF/microwave modules, and high-end electronics that have not transitioned to lead-free processes.

Automatic Feeding Solutions 

Automated and precise delivery of solder preforms to improve efficiency, consistency, and throughput in high-volume production.

(a) Tape and Reel Package (b) Waffle Tray Package (c) Plastic Tape Package (d) Blue Film Package

Quality Control Highlights

• High-Purity Raw Materials
  Solder alloys are made with high-purity gold and alloy elements for reliability.

• Full Material Traceability
  All batches are tracked to ensure consistent quality and avoid contamination.

• Alloy & Melting Point Testing
  Each batch is tested for composition and melting point accuracy.

• Performance Verification
  Key properties like wettability, conductivity, and hermeticity are evaluated.

• Clean Processing & Visual Check
  Produced in cleanroom conditions with inspection of surface and dimensions.

• Standard Sampling Procedure
  Inspections follow GB/T2828 S-3 for balanced quality control.