Indium-Based Solder Preforms

What is Indium-Based Solder Preform?

Indium-based solder preforms are low-melting-point alloys， designed for applications requiring flexible bonding and protection of heat-sensitive components. It offers excellent ductility, outstanding wettability, and is ideal for low-temperature soldering, infrared devices, thermal interface bonding, and other high-precision packaging needs.

Alloy Options

Customizable Shapes & Sizes

Available in standard and custom shapes like discs, rectangles, rings, and ovals.

Designed to fit various packaging and automated assembly needs.

Application

Indium-based solder preforms are commonly used in applications requiring low-temperature processing, high flexibility, and excellent thermal conductivity. 

Typical uses include infrared sensor and detector packaging, thermal interface bonding (TIM), photonic and laser modules, LCD and panel assembly, and precision components requiring pressure relief or hermetic sealing.

Automatic Feeding Solutions

Automated and precise delivery of solder preforms to improve efficiency, consistency, and throughput in high-volume production.

(a) Tape and Reel Package (b) Waffle Tray Package (c) Plastic Tape Package (d) Blue Film Package

Quality Control Highlights

• High-Purity Raw Materials
  Solder alloys are made with high-purity gold and alloy elements for reliability.

• Full Material Traceability
  All batches are tracked to ensure consistent quality and avoid contamination.

• Alloy & Melting Point Testing
  Each batch is tested for composition and melting point accuracy.

• Performance Verification
  Key properties like wettability, conductivity, and hermeticity are evaluated.

• Clean Processing & Visual Check
  Produced in cleanroom conditions with inspection of surface and dimensions.

• Standard Sampling Procedure
  Inspections follow GB/T2828 S-3 for balanced quality control.