Lead-Free Solder Spheres

High-performance lead-free spheres for BGA, CSP, and WLP. Excellent solderability and alloy purity for reliable bonding. Suitable for advanced microelectronic packaging.


Key Alloys: SAC305、SAC405、Sn97Ag3
· RoHS-compliant and optimized for lead-free production
· Excellent flow for automated soldering lines
· Custom diameters and composition available
· Application support & alloy matching service
· Fast delivery with cleanroom-grade packaging