Lead-Based Solder Spheres

Lead-based solder spheres offer stable melting points and excellent wettability. Ideal for PCB, BGA, power modules, and hybrid packaging. Reliable choice for conventional and high-temp soldering needs.


Key Alloys: Sn63Pb37、Sn62Pb36Ag2、Sn10Pb88Ag2
· Stable melting point & excellent wettability
· Compatible with conventional & hybrid soldering
· Custom diameters and composition available
· Application support & alloy matching service
· Fast delivery with cleanroom-grade packaging